2019 Conference Agenda


AGENDA – Conferences 2019
Monday 01-April, 2019 - Location: Design & Fashion
7:30 AM Business of Cleans Registration Design Foyer
7:30 AM Breakfast Culture Ballroom
8:45 AM Introductions, Welcome, Conference Overview Organizers
9:00 AM Economic Backdrop for Semiconductors Duncan Meldrum Hilltop Economics
9:30 AM Trends in Advanced Cleans Market Mike Corbett Linx Consulting
10:00 AM From Waste to Reuse: Chemical Waste Management and Environmental Sustainability Kathleen Fiehrer Intel
10:30 AM Break
11:00 AM Current and Future Wet Etch Challenges - Scaling in the New Era Nabil Mistkawi Samsung
11:30 AM Cleaning Efficiency Improvement Solutions for FEOL CMP Katerina Mikhaylichenko Applied Materials
12:00 PM Lunch Culture Ballroom
1:30 PM Filtration and Purification Impact to Cleans Contamination Control Ted Caramberis PALL
2:00 PM Quality of Semiconductor Raw Materials: Evolution and Challenges Yongqiang Lu Sachem
2:30 PM TBD Tianniu Rick Chen Versum Materials
3:00 PM Asymptotically Approaching Zero Defects: The Future of Post-CMP Cleaning Mike White Entegris
3:30 PM Break
4:00 PM Cleaning and Etching Solutions for Advanced Technology Nodes Andreas Klipp BASF
4:30 PM MOL/BEOL Process and Integration Challenges and Solutions Kevin Ryan GLOBALFOUNDRIES
5:00 PM Business of Cleans Conference Ends
2:00-5:00 PM SPCC Pre-Registration Design Foyer
5:30-7:30 PM Network Reception - Yard House, 888 SW 5th Ave
Tuesday 02-April, 2019 - Location: Design & Fashion
7:30 AM - on SPCC Registration Design Foyer
8:00 - 9:00 AM Breakfast Culture Ballroom
Session 1: Session Chairs - Joel Barnett, Frank Holsteyns
9:00 AM Introductions,  Day 1 Welcome, Conference Overview Mark Thirsk and Joel Barnett
9:20 AM Keynote: Semiconductor Process Challenges for Quantum Computing Ravi Pillarisetty Intel
9:55 AM Cobalt pre-metallization clean and functional water rinse in BEOL interconnect Els Kesters - Quoc Toan Le presenting imec
10:15 AM Functional water solutions to enable wet cleaning process Hideaki Iino Kurita
10:35 AM Break
Session 1 Continued: Session Chairs - Yusuke Oniki, Jim Snow
11:00 AM Controlled cobalt recess for advanced interconnect metallization Antoine Pacco imec
11:20 AM Development of Metal Free Wet Etching Chemical for Ruthenium Interconnect Takuya Ohashi TOK
11:40 AM Wet etching of Ruthenium: effect of thermal annealing Quoc Toan Le imec
12:00 PM Interfacial Layer (IL) Engineering to Extend Scalability of High-k Metal Gate for Si CMOS Devices Shariq Siddiqui GLOBALFOUNDRIES
12:20 PM Lunch Culture Ballroom
Session 2: Session Chairs - Shariq Siddiqui, Evelyn Kennedy
1:45 PM Invited: Cleaning Challenges associated with Scaling Boosters and New Device Architectures Oniki Yusuke imec
2:15 PM Development of Selective SiGe Etchants Glenn Westwood Avantor
2:35 PM Thermal Atomic Layer Etching of Silicon Using an Oxidation and “Conversion-Etch” Mechanism Steve George University of Colorado
2:55 PM Si trim applications: benefits and challenges Subhadeep Kal Tokyo Electron
3:15 PM Break
Session 2 continued: Session Chairs - Rick Chen, Jagdish Prasad
3:35 PM Phenomena affecting the rate and equilibrium of aqueous chemical reactions in nanochannels Guy Vereecke imec
3:55 PM Improving cleaning for advanced packaging Simon Braun imec
4:15 PM Effect of bubble on particle agglomeration in W CMP slurry Jin-Goo Park Hanyang University
4:35 PM Optimization of the removal of wafer backside ESC defects arising from ion implantation by scrubber processing with acidic chemical Seiji Ano SCREEN
Session 3: Panel Discussion
5:00 PM Panel Discussion Moderator: Mike Corbett Linx Consulting
6:15 PM Wrap Up/Additional Questions/Adjourn Organizers
6:30 - 8:00 PM Networking Reception/Poster Session Culture Ballroom
Day 1 SPCC End
Wednesday 03-April, 2019 - Location: Design & Fashion
8:00 - 9:00 AM Breakfast Culture Ballroom
Session 4: Session Chairs - Frank Holsteyns, Glenn Gale
9:15 AM Day 2 Welcome Mark Thirsk and Joel Barnett
9:30 AM Invited: Design Technology Co-Optimization Approaches for Integration and Migration to CFET and 3D Logic Jeff Smith Tokyo Electon
10:00 AM Oxide Regrowth Mechanism during Silicon Nitride Etching in Vertical 3D NAND Structure Sangwoo Lim Yonsei Univ
10:20 AM Phosphoric acid rinse impact on CMOS devices Philippe Garnier STM
10:40 AM Hybrid DHF and N2 Jet Spray Cleaning for Silicon Nitride and Metal Layer Kook Hyun An Hanyang University
11:00 AM Break
Session 4 Continued: Session Chair - Chris Sparks
11:25 AM Invited:  Python based data analysis for Time of Flight Secondary ion mass spectrometer data Sean Stuart The Aerospace Company
11:55 AM Optimization of Single Nanoparticle ICP-MS Analysis for Controlling Nanoparticles in Process Chemicals Lisa Mey-Ami Balazs NanoAnalysis
12:15 PM Universal surface enhanced Raman spectroscopy Ali Altun UNISERS
12:35 PM Lunch Culture Ballroom
12:35 PM Technical Committee Lunch Frank Boardroom
2:00 PM Invited: A Slower Global Economy - But Watching Out for Recession Duncan Meldrum Hilltop Economics
Session 5: Session Chairs - Jin-Goo Park, Meredith Beebe Duncan Meldrum
2:25 PM Particle adsorption model on silicon wafer for clarifying required ultrapure water quality Yoichi Tanaka Kurita
2:45 PM Monitoring and Remediation of Contaminants in Bulk Chemical Eugene Shalyt ECI
3:05 PM New Methods To Reduce Variation In Bare Wafer Particle Inspection Results Harvey Tang Entegris
3:25 PM Contamination Kinetics Of Airborne Ammonia On Chromium-Coated Wafer In Cleanroom Conditions Minh-Phuong Tran CEA-Leti
3:45 PM Wrap Up/Additional Questions/Adjourn Organizers
4:00 PM Day 2 SPCC End
Poster Session and Networking Reception - Location: Culture Ballroom
Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects Ken Harada Mitsubishi Chemical
The Effects of Reductant on the Cleaning Performance for Ceria slurries with Post CMP cleaning Areji Takanaka Kanto
Novel method to characterize the retention of polydisperse particles by advanced membranes Suwen Liu Entegris
TiN Hardmask Wet Etching and Post Etch Residue Removal in BEoL Andreas Klipp BASF
Development of Wet-etch Chemistries for Selective Silicon Nitride Removal in 3D NAND Structure CK Ge Versum
Post-Etch Residue Removal for Cobalt Contact and Interconnect Wilson Yeh Dupont
Development of Monitoring Technique for High Temperature  Phosphoric Acid by Spectroscopy Yutaro Tsuchisaka Horiba
TiN/High-K Dielectric Selective Etching for Work Function Metal removal with dielectric compatibility Wei-Shao.Tung Dupont
Chemically Controlled Megasonic Cleaning Technology for Higher PRE and Lower Pattern Damage Bong Kyun Kang BASF
Study on Wet Etching of Dummy Poly-Si Dongjoo Shin SKKU
Optimization of Water Polishing for an Improved Abrasive Removal Seokjun Hong SKKU
Removal of Nano Particles on the Hard Mask Wafer Backside using Brush Cleaning Hyun-Tae Kim Hanyang Univ
Surface Analysis for EUV Lithography Process Outgassing Studies Xiaoyu Zou Balazs NanoAnalysis
Elimination of Surface Particles with Lobe Signature by Optimizing Post-Ash Cleans Dhiman Bhattacharyya GLOBALFOUNDRIES
Wet Etchant for DRAM Word line Titanium Nitride Recess with Selectivity to Tungsten Wilson Yeh Dupont
Humidity Control in a FOUP by Laminar Air Curtain (LAC) When FOUP Door is in Open Condition Shih-Cheng Hu NTUT
Investigation of Ceria Abrasive Removal during Post Chemical Mechanical Polishing Cleaning Juhwan Kim SKKU
Aluminum Nitride Removal Formulation with Isotropic Silicon Etching Property Chung-Yi Chang Versum
Material Solution toward Efficient Polysilicon post-CMP Clean Jhih-Fong Lin Dupont
Advances of Oxide PCMP Clean Process: A Total Solution toward Superior Defect Performance Jhih-Fong Lin Dupont
Approach toward enhanced cerium residue control on post-CMP cleaned surface Jhih-Fong Lin Dupont